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Labtech 3 Index Bond Ball Mill

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    The Bond ball mill work index is one of the most commonly used grindability tests in mining, and is often referred to as the Bond work index.. The test is a 'locked-cycle' test where ground product is removed from test cycles and replaced by fresh feed.

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    Bond Ball Mill Index Test JKTech. The Bond Ball Mill Work Index is a measure of the resistance of the material to grinding in a ball mill. It can be used to determine the grinding power required for a given throughput of material under ball mill grinding conditions. It is a 'locked cycle' test conducted in closed circuit with a laboratory screen.

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    A Bond Ball Mill Work Index may also be used in the simulation and optimisation of existing mill(s) and the associated grinding circuit(s). Sample Requirements: A minimum of 8 kg of material crushed to nominally minus 10 mm is preferred. JKTech would stage crush the sample to minus 3.35 mm, as required for the Bond Ball Mill Work Index test feed.

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    The ability to simulate the Bond work index test also allows examination of truncated ball mill feed size distributions on the work index. For grinding circuits where the feed to a ball mill is sent directly to the classifier and the cyclone underflow feeds the ball mill (see Figure 3.10), a question arises as to whether this practice will alter the ball mill work index (BW i) of the material

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